40-3571 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish - Mating	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Post	Termination	Features	Pitch - Mating	Pitch - Mating	Type	Type	Type	Housing Material	Pitch - Post	Pitch - Post
Aries Electronics 40-3571-11	0.11 in	2.78 mm	1 A	Gold	Beryllium Copper	10 çin	0.25 çm	Through Hole	10 çin	0.25 çm	Beryllium Copper	UL94 V-0	40	20	2	Gold	Solder	Closed Frame	0.1 in	2.54 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	2.54 mm	0.1 in
Aries Electronics 40-3571-16	0.11 in	2.78 mm	1 A	Nickel Boron	Beryllium Nickel	50 µin	1.27 µm	Through Hole	50 µin	1.27 µm	Beryllium Nickel	UL94 V-0	40	20	2	Nickel Boron	Solder	Closed Frame	0.1 in	2.54 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	2.54 mm	0.1 in
Aries Electronics 40-3571-10	0.11 in	2.78 mm	1 A		Beryllium Copper	200 µin	5.08 µm	Through Hole	200 µin	5.08 µm	Beryllium Copper	UL94 V-0	40	20	2	Tin	Solder	Closed Frame	0.1 in	2.54 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	2.54 mm	0.1 in