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CONN IC DIP SOCKET 10POS GOLD
| Part | Contact Finish - Post | Housing Material | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Material Flammability Rating | Mounting Type | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Solder | DIP | 5.08 mm | 0.2 in | Beryllium Copper | 10 çin | 0.25 çm | Gold | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | Open Frame | 200 µin | 5.08 µm | 2 x 5 | 10 | Brass | UL94 V-0 | Surface Mount | 3 A |
Aries Electronics | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | Solder | DIP | 5.08 mm | 0.2 in | Beryllium Copper | 10 çin | 0.25 çm | Gold | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | Open Frame | 200 µin | 5.08 µm | 2 x 5 | 10 | Brass | UL94 V-0 | Through Hole | 3 A |