36-6513 Series

Catalog

CONN IC DIP SOCKET 36POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Housing Material	Pitch - Post	Operating Temperature (Min)	Operating Temperature (Max)	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Material - Mating	Row Spacing	Type	Features	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Post	Termination	Contact Finish Thickness - Post
Aries Electronics 36-6513-10	0.125 in	UL94 V-0	3 A	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	-55 °C	105 °C	2	18	36	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Closed Frame	0.1 in	Tin	10 µin	Through Hole	Brass	Solder	200 µin
Aries Electronics 36-6513-11	0.125 in	UL94 V-0	3 A	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	-55 °C	105 °C	2	18	36	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Closed Frame	0.1 in	Gold	10 µin	Through Hole	Brass	Solder	10 µin
Aries Electronics 36-6513-10H	0.125 in	UL94 V-0	3 A	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	-55 °C	105 °C	2	18	36	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Closed Frame	0.1 in	Tin	10 µin	Through Hole	Brass	Solder	200 µin
Aries Electronics 36-6513-10T	0.125 in	UL94 V-0	3 A	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	-55 °C	105 °C	2	18	36	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Closed Frame	0.1 in	Tin	10 µin	Through Hole	Brass	Solder	200 µin