36-6513 Series

Catalog

CONN IC DIP SOCKET 36POS GOLD

Part	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Termination	Type	Type	Type	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Current Rating (Amps)	Mounting Type	Housing Material	Contact Material - Mating	Pitch - Post	Pitch - Post
Aries Electronics 36-6513-10	Gold	36	Brass	Solder	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	3.18 mm	0.125 in	200 µin	5.08 µm	105 ░C	-55 °C	Tin	0.1 in	2.54 mm	UL94 V-0	3 A	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	2.54 mm	0.1 in
Aries Electronics 36-6513-11	Gold	36	Brass	Solder	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	3.18 mm	0.125 in	10 çin	0.25 çm	105 ░C	-55 °C	Gold	0.1 in	2.54 mm	UL94 V-0	3 A	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	2.54 mm	0.1 in
Aries Electronics 36-6513-10H	Gold	36	Brass	Solder	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	3.18 mm	0.125 in	200 µin	5.08 µm	105 ░C	-55 °C	Tin	0.1 in	2.54 mm	UL94 V-0	3 A	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	2.54 mm	0.1 in
Aries Electronics 36-6513-10T	Gold	36	Brass	Solder	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	3.18 mm	0.125 in	200 µin	5.08 µm	105 ░C	-55 °C	Tin	0.1 in	2.54 mm	UL94 V-0	3 A	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	2.54 mm	0.1 in