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CONN IC DIP SOCKET ZIF 24POS TIN
| Part | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Termination | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Type | Type | Type | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 24 | UL94 V-0 | Beryllium Copper | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | Solder | Through Hole | Closed Frame | 0.1 in | 2.54 mm | Beryllium Copper | 1 A | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | 24 | UL94 V-0 | Beryllium Copper | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | Solder | Through Hole | Closed Frame | 0.1 in | 2.54 mm | Beryllium Copper | 1 A | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | 24 | UL94 V-0 | Beryllium Copper | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | Solder | Through Hole | Closed Frame | 0.1 in | 2.54 mm | Beryllium Copper | 1 A | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled |