24-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Termination Post Length	Current Rating	Material Flammability Rating	Contact Material - Mating	Termination	Row Spacing	Type	Contact Finish - Post	Pitch - Mating	Contact Finish Thickness - Post	Mounting Type	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish Thickness - Mating	Housing Material	Features	Contact Finish - Mating	Contact Material - Post	Pitch - Post
Aries Electronics 24-3575-18	0.11 in	1 A	UL94 V-0	Beryllium Copper	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Tin	0.1 in	200 µin	Through Hole	2	24	12	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Tin	Beryllium Copper	0.1 in
Aries Electronics 24-3575-11	0.11 in	1 A	UL94 V-0	Beryllium Copper	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Tin	0.1 in	200 µin	Through Hole	2	24	12	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Tin	Beryllium Copper	0.1 in
Aries Electronics 24-3575-16	0.11 in	1 A	UL94 V-0	Beryllium Copper	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Tin	0.1 in	200 µin	Through Hole	2	24	12	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Tin	Beryllium Copper	0.1 in
Aries Electronics 24-3575-10	0.11 in	1 A	UL94 V-0	Beryllium Copper	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Tin	0.1 in	200 µin	Through Hole	2	24	12	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Tin	Beryllium Copper	0.1 in