24-1508 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Number of Positions or Pins (Grid)	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Termination	Contact Finish - Post	Current Rating (Amps)	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Material - Post [custom]	Housing Material	Features	Termination Post Length [x]	Termination Post Length [x]	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length
Aries Electronics 24-1508-21	24	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	0.1 in	2.54 mm	-55 °C	125 °C	Through Hole	Wire Wrap	Gold	3 A	DIP	5.08 mm	0.2 in	10 çin	0.25 çm	Gold	Brass	Polyamide (PA46) Nylon 4/6	Closed Frame	0.36 in	9.14 mm	2.54 mm	0.1 in
Aries Electronics 24-1508-30	24	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	0.1 in	2.54 mm	-55 °C	105 ░C	Through Hole	Wire Wrap	Tin	3 A	DIP	5.08 mm	0.2 in	200 µin	5.08 µm	Gold	Brass	Polyamide (PA46) Nylon 4/6	Closed Frame			2.54 mm	0.1 in	0.5 in	12.7 mm
Aries Electronics 24-1508-31	24	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	0.1 in	2.54 mm	-55 °C	125 °C	Through Hole	Wire Wrap	Gold	3 A	DIP	5.08 mm	0.2 in	10 çin	0.25 çm	Gold	Brass	Polyamide (PA46) Nylon 4/6	Closed Frame			2.54 mm	0.1 in	0.5 in	12.7 mm