Beta
⌘K
CONN EDGE DUAL FML 180POS 0.020
| Part | Material - Insulation | Contact Material | Card Thickness | Card Thickness | Features | Number of Positions | Read Out | Pitch [x] | Pitch [x] | Contact Finish Thickness | Contact Finish Thickness | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish | Card Type | Number of Rows | Color | Gender | Number of Positions/Bay/Row [custom] | Mounting Type | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Liquid Crystal Polymer (LCP) | Copper Alloy | 0.062 in | 1.57 mm | Board Guide Pick and Place Solder Retention | 180 | Dual | 0.5 mm | 0.02 in | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Gold | Non Specified - Dual Edge | 2 | Black | Female | 90 | Surface Mount | Solder |