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SQT-119 Series

Manufacturer: Samtec Inc.

Catalog

CONN RCPT 38POS 0.079 GOLD PCB

PartMounting TypeRow Spacing - MatingRow Spacing - MatingContact Finish Thickness - MatingContact Finish Thickness - MatingStyleContact Finish - MatingCurrent Rating (Amps)Insulation MaterialTerminationConnector TypePitch - Mating [x]Pitch - Mating [x]Number of Positions LoadedInsulation ColorContact ShapeFastening TypeContact MaterialMaterial Flammability RatingNumber of RowsContact TypeInsulation HeightInsulation HeightContact Finish - PostNumber of PositionsOperating Temperature [Min]Operating Temperature [Max]Contact Length - PostContact Length - PostContact Finish Thickness - MatingContact Finish Thickness - PostContact Finish Thickness - Post
Samtec Inc.
Through Hole
0.079 in
2 mm
10 çin
0.25 çm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
2
Forked
6.35 mm
0.25 in
Tin
38
-55 °C
125 °C
5.28 mm
0.208 in
Samtec Inc.
Through Hole
0.079 in
2 mm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
2
Forked
6.35 mm
0.25 in
Tin
38
-55 °C
125 °C
5.28 mm
0.208 in
Flash
Samtec Inc.
Through Hole
10 çin
0.25 çm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
1
Forked
6.35 mm
0.25 in
Tin
19
-55 °C
125 °C
2.29 mm
0.09 "
Samtec Inc.
Through Hole
0.079 in
2 mm
50 µin
1.27 µm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
Forked
6.35 mm
0.25 in
Gold
76
-55 °C
125 °C
2.29 mm
0.09 "
3 µin
0.076 µm
Samtec Inc.
Through Hole
10 çin
0.25 çm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
1
Forked
6.35 mm
0.25 in
Tin
19
-55 °C
125 °C
2.29 mm
0.09 "
Samtec Inc.
Through Hole
10 çin
0.25 çm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
1
Forked
6.35 mm
0.25 in
Tin
19
-55 °C
125 °C
15.24 mm
0.6 in
Samtec Inc.
Through Hole
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
1
Forked
6.35 mm
0.25 in
Tin
19
-55 °C
125 °C
15.24 mm
0.6 in
Flash
Samtec Inc.
Through Hole
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
1
Forked
6.35 mm
0.25 in
Tin
19
-55 °C
125 °C
5.28 mm
0.208 in
Flash
Samtec Inc.
Through Hole
10 çin
0.25 çm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
1
Forked
6.35 mm
0.25 in
Tin
19
-55 °C
125 °C
5.28 mm
0.208 in
Samtec Inc.
Through Hole
0.079 in
2 mm
Board to Board
Cable
Gold
5.1 A
Liquid Crystal Polymer (LCP)
Solder
Receptacle
0.079 in
2 mm
All
Black
Square
Push-Pull
Phosphor Bronze
UL94 V-0
5
Forked
6.35 mm
0.25 in
Tin
95
-55 °C
125 °C
5.28 mm
0.208 in
Flash