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CONN IC DIP SOCKET 20POS GOLD
| Part | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Material Flammability Rating | Housing Material | Termination Post Length | Termination Post Length | Contact Finish - Mating | Type | Type | Type | Current Rating (Amps) | Termination | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 20 | Beryllium Copper | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Through Hole | 200 µin | 5.08 µm | Open Frame | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.5 in | 12.7 mm | Gold | 0.4 in | 10.16 mm | DIP | 3 A | Wire Wrap | Tin | 105 ░C | -55 °C | Brass |