CONN HEADER SMD R/A 146P 0.8MM
| Part | Termination | Shrouding | Contact Shape | Number of Rows | Number of Positions | Insulation Material | Row Spacing - Mating | Row Spacing - Mating | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material | Contact Finish - Mating | Current Rating (Amps) | Fastening Type | Contact Type | Insulation Height | Insulation Height | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Connector Type | Pitch - Mating | Pitch - Mating | Mounting Type | Contact Length - Mating [x] | Contact Length - Mating [x] | Material Flammability Rating | Insulation Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Unshrouded | Square | 2 | 146 | Liquid Crystal Polymer (LCP) | 1.2 mm | 0.047 in | All | 10 çin | 0.25 çm | Phosphor Bronze | Gold | 2.7 A | Push-Pull | Male Pin | 3.05 mm | 0.12 in | -55 °C | 125 °C | Gold | 3 µin | 0.076 µm | Header | 0.031 in | 0.8 mm | Surface Mount Right Angle | 1.9 mm | 0.075 in | UL94 V-0 | Black |