40-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Material Flammability Rating	Current Rating	Termination Post Length	Housing Material	Row Spacing	Type	Pitch - Post	Features	Mounting Type	Contact Material - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Termination	Contact Material - Mating	Contact Finish - Mating	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 40-3551-16	UL94 V-0	1 A	0.11 in	Glass Filled Polyphenylene Sulfide PPS	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Closed Frame	Through Hole	Beryllium Copper	20	40	2	50 µin	Nickel Boron	50 µin	Solder	Beryllium Copper	Boron Nickel	0.1 in
Aries Electronics 40-3551-11	UL94 V-0	1 A	0.11 in	Glass Filled Polyphenylene Sulfide PPS	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Closed Frame	Through Hole	Beryllium Copper	20	40	2		Gold		Solder	Beryllium Copper	Gold	0.1 in
Aries Electronics 40-3551-10	UL94 V-0	1 A	0.11 in	Glass Filled Polyphenylene Sulfide PPS	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Closed Frame	Through Hole	Beryllium Copper	20	40	2	200 µin	Tin	200 Ąin	Solder	Beryllium Copper	Tin	0.1 in
Aries Electronics 40-3551-18	UL94 V-0	1 A	0.11 in	Glass Filled PEEK Polyetheretherketone	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Closed Frame	Through Hole	Beryllium Nickel	20	40	2	50 µin	Nickel Boron	50 µin	Solder	Beryllium Nickel	Boron Nickel	0.1 in	250 °C	-55 °C