28-3518 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Housing Material	Mounting Type	Pitch - Post	Contact Finish - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish - Post	Contact Material - Post	Termination	Contact Material - Mating	Row Spacing	Type	Features	Material Flammability Rating	Termination Post Length	Current Rating
Aries Electronics 28-3518-10	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-10M	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-102	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-10H	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-10TLH	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-111	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	10 µin	Gold	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-11H	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	10 µin	Gold	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-10T	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-01	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	10 µin	Gold	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A
Aries Electronics 28-3518-101	14	28	2	Glass Filled Nylon 4/6 PA46 Polyamide	Through Hole	0.1 in	Gold	0.1 in	10 µin	200 µin	Tin	Brass	Solder	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Open Frame	UL94 V-0	0.125 in	3 A