CONN HEADER SMD 28POS 2MM
| Part | Pitch - Mating [x] | Pitch - Mating [x] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Shrouding | Number of Positions Loaded | Contact Material | Row Spacing - Mating | Row Spacing - Mating | Contact Length - Mating | Contact Length - Mating | Termination | Fastening Type | Features | Insulation Color | Contact Finish - Mating | Number of Rows | Insulation Material | Number of Positions | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Contact Type | Insulation Height | Insulation Height | Connector Type | Contact Shape | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.079 in | 2 mm | 10 çin | 0.25 çm | Tin | Shrouded - 4 Wall | All | Phosphor Bronze | 0.079 in | 2 mm | 3.05 mm | 0.12 in | Solder | Push-Pull | Keying Slot | Black | Gold | 2 | Liquid Crystal Polymer (LCP) | 28 | 105 ░C | -55 °C | Surface Mount | Male Pin | 4.83 mm | 0.19 in | Header | Square | ||||
Samtec Inc. | 0.079 in | 2 mm | 3 µin | 0.076 µm | Tin | Shrouded - 4 Wall | All | Phosphor Bronze | 0.079 in | 2 mm | 3.05 mm | 0.12 in | Solder | Push-Pull | Keying Slot | Black | Gold | 2 | Liquid Crystal Polymer (LCP) | 28 | 105 ░C | -55 °C | Through Hole | Male Pin | 4.83 mm | 0.19 in | Header | Square | 0.117 in | 2.97 mm | ||
Samtec Inc. | 0.079 in | 2 mm | 20 µin | 0.51 µm | Gold | Shrouded - 4 Wall | All | Phosphor Bronze | 0.079 in | 2 mm | 3.05 mm | 0.12 in | Solder | Push-Pull | Keying Slot | Black | Gold | 2 | Liquid Crystal Polymer (LCP) | 28 | 125 °C | -55 °C | Surface Mount | Male Pin | 4.83 mm | 0.19 in | Header | Square | 3 µin | 0.076 µm |