20-1518 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Material - Post [custom]	Termination	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Features	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Type	Type	Type	Termination Post Length	Termination Post Length	Contact Material - Mating	Mounting Type
Aries Electronics 20-1518-10T	Brass	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm	3 A	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	UL94 V-0	20	Tin	200 µin	5.08 µm	Gold	DIP	5.08 mm	0.2 in	3.18 mm	0.125 in	Beryllium Copper	Through Hole
Aries Electronics 20-1518-11	Brass	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm	3 A	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	UL94 V-0	20	Gold	10 çin	0.25 çm	Gold	DIP	5.08 mm	0.2 in	3.18 mm	0.125 in	Beryllium Copper	Through Hole
Aries Electronics 20-1518-11H	Brass	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm	3 A	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	UL94 V-0	20	Gold	10 çin	0.25 çm	Gold	DIP	5.08 mm	0.2 in	3.18 mm	0.125 in	Beryllium Copper	Through Hole
Aries Electronics 20-1518-10H	Brass	Solder	2.54 mm	0.1 in	0.1 in	2.54 mm	3 A	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	UL94 V-0	20	Tin	200 µin	5.08 µm	Gold	DIP	5.08 mm	0.2 in	3.18 mm	0.125 in	Beryllium Copper	Through Hole