CONN IC DIP SOCKET ZIF 48POS
| Part | Contact Finish - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Housing Material | Features | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Contact Finish - Post | Mounting Type | Contact Material - Post | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3570-16 | Nickel Boron | 48 | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | Nickel Boron | Through Hole | Beryllium Nickel | 0.1 in | 2.54 mm | UL94 V-0 | 1.27 µm | 50 µin | Solder | 1 A |
Aries Electronics 48-3570-10 | 48 | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | 5.08 µm | 200 µin | 0.11 in | 2.78 mm | Tin | Through Hole | Beryllium Copper | 0.1 in | 2.54 mm | UL94 V-0 | 5.08 µm | 200 µin | Solder | 1 A | |
Aries Electronics 48-3570-11 | Gold | 48 | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | 0.25 çm | 10 çin | 0.11 in | 2.78 mm | Gold | Through Hole | Beryllium Copper | 0.1 in | 2.54 mm | UL94 V-0 | 0.25 çm | 10 çin | Solder | 1 A |