48-3570 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Row Spacing | Type | Pitch - Post | Number of Positions or Pins (Grid) | Grid Columns | Grid Rows | Housing Material | Termination | Contact Material - Post | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Mounting Type | Features | Contact Finish Thickness - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 48 | 24 | 2 | Glass Filled Polyphenylene Sulfide PPS | Solder | Beryllium Copper | 0.1 in | 10 µin | Beryllium Copper | Gold | Through Hole | Closed Frame | 10 µin | Gold |
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 48 | 24 | 2 | Glass Filled Polyphenylene Sulfide PPS | Solder | Beryllium Copper | 0.1 in | 200 Ąin | Beryllium Copper | Tin | Through Hole | Closed Frame | 200 µin | Tin |
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 48 | 24 | 2 | Glass Filled Polyphenylene Sulfide PPS | Solder | Beryllium Nickel | 0.1 in | 50 µin | Beryllium Nickel | Nickel Boron | Through Hole | Closed Frame | 50 µin | Boron Nickel |