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CONN IC DIP SOCKET 14POS GOLD
| Part | Contact Material - Mating | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Features | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Material Flammability Rating | Termination | Current Rating (Amps) | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Gold | 105 ░C | -55 °C | Closed Frame Elevated | 0.3 " | 7.62 mm | DIP | 0.1 in | 2.54 mm | Gold | 14 | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.56 mm | 0.14 in | 30 Áin | 0.76 Ám | Brass | UL94 V-0 | Solder | 3 A | Through Hole |