DF12 (3.0) Series
Manufacturer: Hirose Electric Co Ltd
CONN HDR 32POS SMD GOLD
| Part | Features | Height Above Board | Number of Positions | Mounting Type | Mated Stacking Height | Contact Finish | Connector Type | Number of Rows | Contact Finish Thickness | Pitch |
|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.091 in | 32 | Surface Mount | 3 mm | Gold | Header Outer Shroud Contacts | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.091 in | 32 | Surface Mount | 3 mm | Gold | Header Outer Shroud Contacts | 2 | 0.02 in | |
Hirose Electric Co Ltd | ||||||||||
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.087 in | 40 | Surface Mount | 3 mm | Gold | Center Strip Contacts Receptacle | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.091 in | 40 | Surface Mount | 3 mm | Gold | Header Outer Shroud Contacts | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.087 in | 80 | Surface Mount | 3 mm | Gold | Center Strip Contacts Receptacle | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.091 in | 10 | Surface Mount | 3 mm | Gold | Header Outer Shroud Contacts | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.087 in | 20 | Surface Mount | 3 mm | Gold | Center Strip Contacts Receptacle | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.091 in | 30 | Surface Mount | 3 mm | Gold | Header Outer Shroud Contacts | 2 | 8 µin | 0.02 in |
Hirose Electric Co Ltd | Board Guide Solder Retention | 0.091 in | 30 | Surface Mount | 3 mm | Gold | Header Outer Shroud Contacts | 2 | 8 µin | 0.02 in |