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SOCKET ADAPTER DIP TO 8SOIC
| Part | Contact Material - Mating | Convert To (Adapter End) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Pins | Mounting Type | Contact Finish - Mating | Termination Post Length | Termination Post Length | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Housing Material | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | SOIC | 10 çin | 0.25 çm | 8 | Surface Mount | Gold | 0.089 in | 2.28 mm | DIP | 0.3 in | 7.62 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | Brass | 0.1 in | 2.54 mm | Solder | Gold | 10 çin | 0.25 çm | UL94 V-0 | 1.27 mm | 0.05 in | 3 A |