CONN IC DIP SOCKET 8POS GOLD
| Part | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Type | Type | Type | Current Rating (Amps) | Mounting Type | Features | Housing Material | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Contact Finish - Post | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating | Material Flammability Rating | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | DIP | 5.08 mm | 0.2 in | 3 A | Right Angle Through Hole Vertical | Closed Frame | Glass Filled Nylon 4/6 Polyamide (PA46) | Solder | 200 µin | 5.08 µm | 3.56 mm | 0.14 in | Tin | 8 | 2.54 mm | 0.1 in | Beryllium Copper | Gold | UL94 V-0 | |
Aries Electronics | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | DIP | 5.08 mm | 0.2 in | 1.5 A | Right Angle Through Hole Vertical | Closed Frame | Polyamide (PA46) Nylon 4/6 | Solder | 10 çin | 0.25 çm | 3.68 mm | 0.145 " | Gold | 8 | 2.54 mm | 0.1 in | Phosphor Bronze | Gold | UL94 V-0 | Phosphor Bronze |