CONN IC DIP SOCKET ZIF 48POS
| Part | Pitch - Post | Pitch - Post | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Termination | Material Flammability Rating | Contact Finish - Post | Mounting Type | Features | Type | Type | Type | Contact Material - Post | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3571-16 | 2.54 mm | 0.1 in | Nickel Boron | 0.1 in | 2.54 mm | 48 | Solder | UL94 V-0 | Nickel Boron | Through Hole | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Beryllium Nickel | Beryllium Nickel | 1.27 µm | 50 µin | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | 1.27 µm | 50 µin | 0.11 in | 2.78 mm |
Aries Electronics 48-3571-11 | 2.54 mm | 0.1 in | Gold | 0.1 in | 2.54 mm | 48 | Solder | UL94 V-0 | Gold | Through Hole | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Beryllium Copper | Beryllium Copper | 0.25 çm | 10 çin | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | 0.25 çm | 10 çin | 0.11 in | 2.78 mm |
Aries Electronics 48-3571-10 | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 48 | Solder | UL94 V-0 | Tin | Through Hole | Closed Frame | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Beryllium Copper | Beryllium Copper | 5.08 µm | 200 µin | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | 5.08 µm | 200 µin | 0.11 in | 2.78 mm |