48-3571 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Termination Post Length	Material Flammability Rating	Current Rating	Mounting Type	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Mating	Termination	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Contact Material - Post	Housing Material	Row Spacing	Type	Contact Finish Thickness - Mating	Pitch - Post	Contact Finish - Mating	Features
Aries Electronics 48-3571-10	0.11 in	UL94 V-0	1 A	Through Hole	Tin	200 µin	Beryllium Copper	0.1 in	Solder	48	24	2	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 Ąin	0.1 in	Tin	Closed Frame
Aries Electronics 48-3571-16	0.11 in	UL94 V-0	1 A	Through Hole	Nickel Boron	50 µin	Beryllium Nickel	0.1 in	Solder	48	24	2	Beryllium Nickel	Glass Filled Polyphenylene Sulfide PPS	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in	Boron Nickel	Closed Frame
Aries Electronics 48-3571-11	0.11 in	UL94 V-0	1 A	Through Hole	Gold	10 µin	Beryllium Copper	0.1 in	Solder	48	24	2	Beryllium Copper	Glass Filled Polyphenylene Sulfide PPS	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	10 µin	0.1 in	Gold	Closed Frame