10145193 Series

Catalog

VERTICAL HEADER

Part	Pitch - Mating	Pitch - Mating	Features	Row Spacing - Mating	Row Spacing - Mating	Connector Type	Contact Type	Shrouding	Contact Shape	Insulation Color	Contact Finish - Post	Contact Material	Material Flammability Rating	Style	Insulation Material	Mounting Type	Number of Positions	Number of Rows	Termination	Insulation Height	Insulation Height	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Fastening Type	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Amphenol ICC (FCI) 10145193-204KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black	Tin	Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	4	2	Solder	13.35 mm	0.526 in	All	0.3 µm	12 µin	Detent Lock
Amphenol ICC (FCI) 10145193-324KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black		Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	24	2	Solder	13.35 mm	0.526 in	All			Detent Lock	Gold	3 µin	0.076 µm
Amphenol ICC (FCI) 10145193-312KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black		Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	12	2	Solder	13.35 mm	0.526 in	All			Detent Lock	Gold	3 µin	0.076 µm
Amphenol ICC (FCI) 10145193-130KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black	Tin	Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	30	2	Solder	13.35 mm	0.526 in	All	0.3 µm	12 µin	Detent Lock			118.1 µin	3 µm
Amphenol ICC (FCI) 10145193-230KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black	Tin	Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	30	2	Solder	13.35 mm	0.526 in	All	0.3 µm	12 µin	Detent Lock
Amphenol ICC (FCI) 10145193-108KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black	Tin	Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	8	2	Solder	13.35 mm	0.526 in	All	0.3 µm	12 µin	Detent Lock			118.1 µin	3 µm
Amphenol ICC (FCI) 10145193-224KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black	Tin	Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	24	2	Solder	13.35 mm	0.526 in	All	0.3 µm	12 µin	Detent Lock
Amphenol ICC (FCI) 10145193-306KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black		Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	6	2	Solder	13.35 mm	0.526 in	All			Detent Lock	Gold	3 µin	0.076 µm
Amphenol ICC (FCI) 10145193-322KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black		Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	22 positions	2	Solder	13.35 mm	0.526 in	All			Detent Lock	Gold	3 µin	0.076 µm
Amphenol ICC (FCI) 10145193-126KLF	0.05 in	1.27 mm	Board Guide Solder Retention	2.06 mm	0.081 in	Header	Male Pin	Shrouded - 4 Wall	Square	Black	Tin	Copper Alloy	UL94 V-0	Board to Cable/Wire	Thermoplastic	Surface Mount	26	2	Solder	13.35 mm	0.526 in	All	0.3 µm	12 µin	Detent Lock			118.1 µin	3 µm