38-3513 Series

Catalog

CONN IC DIP SOCKET 38POS GOLD

Part	Termination	Contact Finish - Mating	Type	Type	Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Features	Pitch - Post	Pitch - Post	Contact Finish - Post	Housing Material	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]
Aries Electronics 38-3513-10	Solder	Gold	0.3 "	7.62 mm	DIP	Beryllium Copper	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	38	10 çin	0.25 çm	Brass	0.1 in	2.54 mm	3.18 mm	0.125 in	UL94 V-0	3 A	105 ░C	-55 °C
Aries Electronics 38-3513-10H	Solder	Gold	0.3 "	7.62 mm	DIP	Beryllium Copper	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	38	10 çin	0.25 çm	Brass	0.1 in	2.54 mm	3.18 mm	0.125 in	UL94 V-0	3 A	105 ░C	-55 °C
Aries Electronics 38-3513-11	Solder	Gold	0.3 "	7.62 mm	DIP	Beryllium Copper	10 çin	0.25 çm	Through Hole	Closed Frame	2.54 mm	0.1 in	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	38	10 çin	0.25 çm	Brass	0.1 in	2.54 mm	3.18 mm	0.125 in	UL94 V-0	3 A	105 ░C	-55 °C
Aries Electronics 38-3513-10T	Solder	Gold	0.3 "	7.62 mm	DIP	Beryllium Copper	200 µin	5.08 µm	Through Hole	Closed Frame	2.54 mm	0.1 in	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	38	10 çin	0.25 çm	Brass	0.1 in	2.54 mm	3.18 mm	0.125 in	UL94 V-0	3 A	105 ░C	-55 °C