CONN SOCKET 12POS 0.1 GOLD PCB
| Part | Termination | Insulation Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Color | Pitch - Mating | Pitch - Mating | Connector Type | Contact Length - Post | Contact Length - Post | Contact Material | Contact Shape | Number of Rows | Number of Positions | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Number of Positions Loaded | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Type | Contact Finish - Post | Insulation Height [z] | Insulation Height [z] | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Fastening Type | Insulation Height | Insulation Height | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Black | 0.1 in | 2.54 mm | Elevated Socket | 0.153 in | 3.89 mm | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Gold | 10 çin | 0.25 çm | Female Socket | Gold | 0.3 in | 7.62 mm | 2.54 mm | 0.1 in | Push-Pull | ||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Black | 0.1 in | 2.54 mm | Elevated Socket | 0.265 in | 6.73 mm | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Gold | 10 çin | 0.25 çm | Female Socket | Gold | 2.54 mm | 0.1 in | Push-Pull | 0.4 in | 10.16 mm | ||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Black | 0.1 in | 2.54 mm | Elevated Socket | 0.153 in | 3.89 mm | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Gold | 10 çin | 0.25 çm | Female Socket | Tin | 0.3 in | 7.62 mm | 2.54 mm | 0.1 in | Push-Pull | ||||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Black | 0.1 in | 2.54 mm | Elevated Socket | 0.215 in | 5.46 mm | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Gold | 10 çin | 0.25 çm | Female Socket | Gold | 0.3 in | 7.62 mm | 2.54 mm | 0.1 in | Push-Pull | ||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Black | 0.1 in | 2.54 mm | Elevated Socket | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Female Socket | Tin | 2.54 mm | 0.1 in | Push-Pull | 0.5 in | 12.7 mm | 0.165 in | 4.19 mm | |||||||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Black | 0.1 in | 2.54 mm | Elevated Socket | 0.115 in | 2.92 mm | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Gold | 10 çin | 0.25 çm | Female Socket | Tin | 2.54 mm | 0.1 in | Push-Pull | 0.4 in | 10.16 mm | ||||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Black | 0.1 in | 2.54 mm | Elevated Socket | 0.265 in | 6.73 mm | Beryllium Copper | Circular | 2 | 12 | UL94 V-0 | -55 °C | 125 °C | Through Hole | All | Gold | 10 çin | 0.25 çm | Female Socket | Tin | 2.54 mm | 0.1 in | Push-Pull | 0.4 in | 10.16 mm |