Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Pitch - Post | Pitch - Post | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Mounting Type | Contact Finish - Mating | Contact Material - Post | Contact Finish - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Termination | Features | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | PGA ZIF (ZIP) | 200 µin | 5.08 µm | 125 °C | -65 ░C | 0.1 in | 2.54 mm | UL94 V-0 | Through Hole | Gold | Beryllium Copper | Tin | Beryllium Copper | 3.18 mm | 0.125 in | Solder | Closed Frame | 1 A | 30 Áin | 0.76 Ám |