CONN RCPT 58POS 0.031 GOLD SMD
| Part | Insulation Height | Insulation Height | Insulation Color | Fastening Type | Pitch - Mating | Pitch - Mating | Number of Rows | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Connector Type | Contact Finish - Mating | Row Spacing - Mating | Row Spacing - Mating | Contact Material | Material Flammability Rating | Contact Shape | Number of Positions | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Current Rating (Amps) | Number of Positions Loaded | Insulation Material | Contact Finish - Post | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.13 in | 3.3 mm | Black | Push-Pull | 0.031 in | 0.8 mm | 2 | Surface Mount | 10 çin | 0.25 çm | Female Socket | 10 çin | 0.25 çm | Pass Through Receptacle | Gold | 1.2 mm | 0.047 in | Beryllium Copper | UL94 V-0 | Square | 58 | -55 °C | 125 °C | Solder | 2.7 A | All | Liquid Crystal Polymer (LCP) | Gold | |
Samtec Inc. | 0.13 in | 3.3 mm | Black | Push-Pull | 0.031 in | 0.8 mm | 2 | Surface Mount | 10 çin | 0.25 çm | Female Socket | 10 çin | 0.25 çm | Pass Through Receptacle | Gold | 1.2 mm | 0.047 in | Beryllium Copper | UL94 V-0 | Square | 58 | -55 °C | 125 °C | Solder | 2.7 A | All | Liquid Crystal Polymer (LCP) | Gold | Pick and Place |
Samtec Inc. | 0.13 in | 3.3 mm | Black | Push-Pull | 0.031 in | 0.8 mm | 2 | Surface Mount | 10 çin | 0.25 çm | Female Socket | 10 çin | 0.25 çm | Pass Through Receptacle | Gold | 1.2 mm | 0.047 in | Beryllium Copper | UL94 V-0 | Square | 58 | -55 °C | 125 °C | Solder | 2.7 A | All | Liquid Crystal Polymer (LCP) | Gold | Board Guide |