36-3513 Series

Catalog

CONN IC DIP SOCKET 36POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Material Flammability Rating	Pitch - Post	Pitch - Post	Operating Temperature [Max]	Operating Temperature [Min]	Features	Termination	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Mounting Type	Type	Type	Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Housing Material	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Contact Material - Mating
Aries Electronics 36-3513-10T	200 µin	5.08 µm	36	UL94 V-0	2.54 mm	0.1 in	105 ░C	-55 °C	Closed Frame	Solder	Gold	10 çin	0.25 çm	Tin	Through Hole	0.3 "	7.62 mm	DIP	3 A	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Brass	Beryllium Copper
Aries Electronics 36-3513-10H	200 µin	5.08 µm	36	UL94 V-0	2.54 mm	0.1 in	105 ░C	-55 °C	Closed Frame	Solder	Gold	10 çin	0.25 çm	Tin	Through Hole	0.3 "	7.62 mm	DIP	3 A	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Brass	Beryllium Copper
Aries Electronics 36-3513-10	200 µin	5.08 µm	36	UL94 V-0	2.54 mm	0.1 in	105 ░C	-55 °C	Closed Frame	Solder	Gold	10 çin	0.25 çm	Tin	Through Hole	0.3 "	7.62 mm	DIP	3 A	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Brass	Beryllium Copper
Aries Electronics 36-3513-11	10 çin	0.25 çm	36	UL94 V-0	2.54 mm	0.1 in	105 ░C	-55 °C	Closed Frame	Solder	Gold	10 çin	0.25 çm	Gold	Through Hole	0.3 "	7.62 mm	DIP	3 A	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	Brass	Beryllium Copper