TMS-108 Series

Catalog

.050" (1.27MM) MICRO HEADER

Part	Insulation Height	Current Rating (Per Contact)	Contact Type	Shrouding	Contact Material	Contact Length - Post	Fastening Type	Contact Finish - Post	Overall Contact Length	Insulation Material	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Material Flammability Rating	Mounting Type	Termination	Contact Length - Mating	Number of Positions	Number of Rows	Style	Insulation Color	Number of Positions Loaded	Contact Finish Thickness - Mating	Connector Type	Contact Shape	Pitch - Mating	Contact Finish Thickness - Post	Row Spacing - Mating
Samtec Inc. TMS-108-51-G-S	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Gold	0.41 in	Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.19 in	8	1	Board	Black	All	10 µin	Header	Square	0.05 in	3 µin
Samtec Inc. TMS-108-51-T-D	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Tin	0.41 in	Liquid Crystal Polymer (LCP)	Tin	105 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.19 in	16	2	Board	Black	All		Header	Square	0.05 in		0.1 in
Samtec Inc. TMS-108-51-T-S	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Tin	0.41 in	Liquid Crystal Polymer (LCP)	Tin	105 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.19 in	8	1	Board	Black	All		Header	Square	0.05 in
Samtec Inc. TMS-108-02-G-S-RA	0.098 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.14 in	Push-Pull	Gold		Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Right Angle Through Hole	Solder	0.1 in	8	1	Board	Black	All	10 µin	Header	Square	0.05 in	3 µin
Samtec Inc. TMS-108-60-L-D	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Tin	0.825 in	Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.605 in	16	2	Board	Black	All	10 µin	Header	Square	0.05 in		0.1 in
Samtec Inc. TMS-108-51-S-S	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Tin	0.41 in	Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.19 in	8	1	Board	Black	All	30 µin	Header	Square	0.05 in
Samtec Inc. TMS-108-02-L-S-RA	0.098 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.14 in	Push-Pull	Tin		Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Right Angle Through Hole	Solder	0.1 in	8	1	Board	Black	All	10 µin	Header	Square	0.05 in
Samtec Inc. TMS-108-02-S-S	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Tin	0.32 in	Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.1 in	8	1	Board	Black	All	30 µin	Header	Square	0.05 in
Samtec Inc. TMS-108-01-L-D-RA	0.197 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.14 in	Push-Pull	Tin		Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Right Angle Through Hole	Solder	0.23 in	16	2	Board	Black	All	10 µin	Header	Square	0.05 in		0.1 in
Samtec Inc. TMS-108-02-SM-S	0.1 in	5 A	Male Pin	Unshrouded	Phosphor Bronze	0.12 in	Push-Pull	Tin	0.32 in	Liquid Crystal Polymer (LCP)	Gold	125 °C	-55 °C	UL94 V-0	Through Hole	Solder	0.1 in	8	1	Board	Black	All	30 µin	Header	Square	0.05 in