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10P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Contact Material - Post [custom] | Features | Contact Finish - Mating | Pitch - Post | Pitch - Post | Housing Material | Material Flammability Rating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Mounting Type | Current Rating (Amps) | Contact Finish - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | Closed Frame Elevated | Gold | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | 2 x 5 | 10 | 3.56 mm | 0.14 in | 105 ░C | -55 °C | 0.1 in | 2.54 mm | Solder | 10 çin | 0.25 çm | 0.3 " | 7.62 mm | DIP | Through Hole | 3 A | Gold | Beryllium Copper | 30 Áin | 0.76 Ám |