114-93 Series
Manufacturer: Mill-Max Manufacturing Corp.
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⌘K
CONN IC DIP SOCKET 28POS GOLD
| Part | Row Spacing | Type | Contact Finish - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Pitch - Post | Pitch - Mating | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Termination | Contact Finish Thickness - Post | Contact Material - Mating | Housing Material | Features | Current Rating | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Mill-Max Manufacturing Corp. | 0.4 in | 0.4" (10.16mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 14 | 28 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 26 | 52 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 12 | 24 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 10 | 20 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.4 in | 0.4" (10.16mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 16 | 32 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 20 | 40 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 25 | 50 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.2 in | 0.2" (5.08mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 5 | 10 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 24 | 48 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |
Mill-Max Manufacturing Corp. | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | Tin-Lead | Gold | 30 µin | Brass Alloy | 125 °C | -55 °C | Surface Mount | 0.1 in | 0.1 in | 32 | 64 | 2 | Solder | 200 µin | Beryllium Copper | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Open Frame | 3 A | 0.125 in |