SDL-111 Series
Manufacturer: Samtec Inc.
CONN RCPT .100" 22POS DUAL TIN
| Part | Contact Type | Insulation Height | Connector Type | Number of Positions | Contact Length - Post | Row Spacing - Mating | Style | Operating Temperature (Min) | Operating Temperature (Max) | Contact Finish - Mating | Pitch - Mating | Number of Positions Loaded | Fastening Type | Number of Rows | Contact Finish - Post | Termination | Mounting Type | Insulation Color | Contact Shape | Contact Material | Insulation Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Female Socket | 0.122 in | Receptacle | 22 | 0.108 in | 0.1 in | Board | -55 °C | 105 °C | Tin | 0.1 in | All | Push-Pull | 2 | Tin | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Female Socket | 0.122 in | Receptacle | 22 | 0.108 in | 0.1 in | Board | -55 °C | 125 °C | Gold | 0.1 in | All | Push-Pull | 2 | Gold | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 µin | 10 µin |
Samtec Inc. | Female Socket | 0.095 in | Receptacle | 22 | 0.095 in | 0.1 in | Board | -55 °C | 105 °C | Tin | 0.1 in | All | Push-Pull | 2 | Tin | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Female Socket | 0.132 in | Receptacle | 22 | 0.108 in | 0.1 in | Board | -55 °C | 125 °C | Gold | 0.1 in | All | Push-Pull | 2 | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 µin | ||
Samtec Inc. | Female Socket | 0.095 in | Receptacle | 22 | 0.095 in | 0.1 in | Board | -55 °C | 125 °C | Gold | 0.1 in | All | Push-Pull | 2 | Gold | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 µin | 10 µin |
Samtec Inc. | Female Socket | 0.095 in | Receptacle | 22 | 0.095 in | 0.1 in | Board | -55 °C | 125 °C | Gold | 0.1 in | All | Push-Pull | 2 | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 µin | ||
Samtec Inc. | Female Socket | 0.083 in | Receptacle | 22 | 0.082 in | 0.1 in | Board | -55 °C | 125 °C | Gold | 0.1 in | All | Push-Pull | 2 | Gold | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 µin | 10 µin |
Samtec Inc. | Female Socket | 0.132 in | Receptacle | 22 | 0.108 in | 0.1 in | Board | -55 °C | 105 °C | Tin | 0.1 in | All | Push-Pull | 2 | Tin | Solder | Through Hole | Black | Circular | Beryllium Copper | Liquid Crystal Polymer (LCP) |