Beta
⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Contact Finish - Mating | Number of Positions or Pins (Grid) | Features | Current Rating (Amps) | Type | Type | Type | Mounting Type | Contact Finish - Post | Material Flammability Rating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Housing Material | Termination | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | 2.54 mm | 0.1 in | Gold | 20 | Closed Frame Elevated | 3 A | DIP | 0.6 in | 15.24 mm | Through Hole | Gold | UL94 V-0 | Beryllium Copper | 10 çin | 0.25 çm | 105 ░C | -55 °C | Glass Filled Nylon 4/6 Polyamide (PA46) | Solder | 3.56 mm | 0.14 in |