SQT-113 Series

Catalog

CONN RCPT 26POS 0.079 GOLD PCB

Part	Insulation Material	Insulation Height	Insulation Height	Insulation Color	Pitch - Mating [x]	Pitch - Mating [x]	Current Rating (Amps)	Contact Type	Contact Finish - Post	Contact Finish Thickness - Mating	Material Flammability Rating	Connector Type	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Fastening Type	Mounting Type	Contact Finish - Mating	Style	Contact Shape	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions Loaded	Termination	Contact Length - Post	Contact Length - Post	Contact Material	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height [custom]	Insulation Height [custom]
Samtec Inc. SQT-113-01-F-D-001	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin	Flash	UL94 V-0	Receptacle	0.079 in	2 mm	26	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	2	-55 °C	125 °C	25	Solder	0.09 "	2.29 mm	Phosphor Bronze
Samtec Inc. SQT-113-03-F-S	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin	Flash	UL94 V-0	Receptacle			13	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	1	-55 °C	125 °C		Solder	0.208 in	5.28 mm	Phosphor Bronze	All
Samtec Inc. SQT-113-01-L-T-RA	Liquid Crystal Polymer (LCP)	6 mm	0.236 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle	0.079 in	2 mm	39	Push-Pull	Through Hole Right Angle	Gold	Board to Board Cable	Square	3	-55 °C	125 °C		Solder	0.09 "	2.29 mm	Phosphor Bronze	All	10 çin	0.25 çm
Samtec Inc. SQT-113-02-L-S	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle			13	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	1	-55 °C	125 °C		Solder	0.6 in	15.24 mm	Phosphor Bronze	All	10 çin	0.25 çm
Samtec Inc. SQT-113-03-LM-D	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle	0.079 in	2 mm	26	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	2	-55 °C	125 °C		Solder	0.208 in	5.28 mm	Phosphor Bronze	All	10 çin	0.25 çm
Samtec Inc. SQT-113-01-LM-D	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle	0.079 in	2 mm	26	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	2	-55 °C	125 °C		Solder	0.09 "	2.29 mm	Phosphor Bronze	All	10 çin	0.25 çm
Samtec Inc. SQT-113-01-F-D	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin	Flash	UL94 V-0	Receptacle	0.079 in	2 mm	26	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	2	-55 °C	125 °C		Solder	0.09 "	2.29 mm	Phosphor Bronze	All
Samtec Inc. SQT-113-01-L-D-RA	Liquid Crystal Polymer (LCP)			Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle	0.079 in	2 mm	26	Push-Pull	Through Hole Right Angle	Gold	Board to Board Cable	Square	2	-55 °C	125 °C		Solder	0.09 "	2.29 mm	Phosphor Bronze	All	10 çin	0.25 çm	0.157 in	4 mm
Samtec Inc. SQT-113-03-L-T	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle	0.079 in	2 mm	39	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	3	-55 °C	125 °C		Solder	0.208 in	5.28 mm	Phosphor Bronze	All	10 çin	0.25 çm
Samtec Inc. SQT-113-03-S-S-013	Liquid Crystal Polymer (LCP)	6.35 mm	0.25 in	Black	0.079 in	2 mm	5.1 A	Forked	Tin		UL94 V-0	Receptacle			13	Push-Pull	Through Hole	Gold	Board to Board Cable	Square	1	-55 °C	125 °C	12	Solder	0.208 in	5.28 mm	Phosphor Bronze		30 Áin	0.76 Ám