TE0745 Series
Manufacturer: Trenz Electronic
SOM 1GB DDR3 XC7Z045-1FBG676C
| Part | RAM Size | Module/Board Type | Flash Size | Operating Temperature (Max) | Operating Temperature (Min) | Connector Type | Core Processor | Size / Dimension Length | Size / Dimension Width | For Use With/Related Products | Suggested Programming Environment | Contents | Utilized IC / Part | Type | Platform | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Trenz Electronic | 1 GB | MPU Core | 64 MB | 70 °C | 0 °C | Samtec Samtec ST5 ST5 | Xilinx Zynq XC7Z045-1FBG676C | 2.05 in | 2.99 in | |||||||
Trenz Electronic | 1 GB | MPU Core | 64 MB | 85 °C | -40 °C | Samtec Samtec ST5 ST5 | Xilinx Zynq XC7Z030-2FBG676I | 2.05 in | 2.99 in | |||||||
Trenz Electronic | ||||||||||||||||
Trenz Electronic | TE0745 | Vivado | Board | TE0745 | FPGA | TE0745 Zynq-7000 AP SoC Carrier | ||||||||||
Trenz Electronic | 1 GB | FPGA MCU | 32 MB | 85 °C | -40 °C | Samtec Samtec ST5 ST5 | ARM® Cortex®-A9 | 2.05 in | 2.99 in | Zynq-7000 (Z-7035) | ||||||
Trenz Electronic | 1 GB | FPGA MCU | 64 MB | 85 °C | -40 °C | Samtec Samtec ST5 ST5 | ARM® Cortex®-A9 | 2.05 in | 2.99 in | Zynq-7000 (Z-7030) |