24-3503 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Features	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Housing Material	Type	Type	Type	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Termination Post Length [x]	Termination Post Length [x]	Termination	Current Rating (Amps)	Contact Finish - Post	Contact Finish - Mating
Aries Electronics 24-3503-21	10 çin	0.25 çm	Beryllium Copper	24	2.54 mm	0.1 in	Closed Frame	Through Hole	-55 °C	125 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.3 "	7.62 mm	DIP	UL94 V-0	0.1 in	2.54 mm	10 çin	0.25 çm	Phosphor Bronze	0.36 in	9.14 mm	Wire Wrap	3 A	Gold	Gold
Aries Electronics 24-3503-20	200 µin	5.08 µm	Beryllium Copper	24	2.54 mm	0.1 in	Closed Frame	Through Hole	-55 °C	105 ░C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.3 "	7.62 mm	DIP	UL94 V-0	0.1 in	2.54 mm	10 çin	0.25 çm	Phosphor Bronze	0.36 in	9.14 mm	Wire Wrap	3 A	Tin	Gold