TMM-149 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 98POS 2MM
| Part | Fastening Type | Contact Type | Material Flammability Rating | Number of Rows | Insulation Color | Mounting Type | Contact Finish - Mating | Row Spacing - Mating | Pitch - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Insulation Material | Style | Number of Positions Loaded | Number of Positions | Contact Material | Termination | Contact Length - Mating | Current Rating (Per Contact) | Contact Shape | Connector Type | Contact Finish - Post | Insulation Height | Shrouding | Overall Contact Length | Contact Length - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Push-Pull | Male Pin | UL94 V-0 | 2 | Black | Surface Mount | Tin | 0.079 in | 0.079 in | -55 °C | 105 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 98 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | ||||
Samtec Inc. | Push-Pull | Male Pin | 2 | Black | Through Hole | Tin | 0.079 in | 0.079 in | -55 °C | 105 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 98 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 0.323 in | 0.138 in | |||
Samtec Inc. | Push-Pull | Male Pin | 4 | Black | Through Hole | Gold | 0.079 in | 0.079 in | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 196 | Phosphor Bronze | Solder | 0.146 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 0.323 in | 0.118 in | 3 µin | ||
Samtec Inc. | Push-Pull | Male Pin | 2 | Black | Through Hole | Gold | 0.079 in | 0.079 in | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 98 | Phosphor Bronze | Solder | 0.146 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 0.323 in | 0.118 in | 10 µin | ||
Samtec Inc. | Push-Pull | Male Pin | UL94 V-0 | 1 | Black | Surface Mount | Gold | 0.079 in | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 49 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 30 µin | ||||
Samtec Inc. | Push-Pull | Male Pin | UL94 V-0 | 1 | Black | Surface Mount | Gold | 0.079 in | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 49 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Gold | 0.059 in | Unshrouded | 20 Ąin | 3 µin | |||
Samtec Inc. | Push-Pull | Male Pin | UL94 V-0 | 1 | Black | Surface Mount | Tin | 0.079 in | -55 °C | 105 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 49 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | |||||
Samtec Inc. | Push-Pull | Male Pin | 2 | Black | Through Hole | Gold | 0.079 in | 0.079 in | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 98 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 0.323 in | 0.138 in | 30 µin | ||
Samtec Inc. | Push-Pull | Male Pin | 1 | Black | Through Hole | Tin | 0.079 in | -55 °C | 105 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 49 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 0.323 in | 0.138 in | ||||
Samtec Inc. | Push-Pull | Male Pin | 1 | Black | Through Hole | Gold | 0.079 in | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Board Board or Cable | All | 49 | Phosphor Bronze | Solder | 0.126 in | 3.2 A | Square | Header | Tin | 0.059 in | Unshrouded | 0.323 in | 0.138 in | 30 µin |