CONN RCPT 4POS 0.05 GOLD SMD
| Part | Insulation Material | Row Spacing - Mating | Row Spacing - Mating | Current Rating (Amps) | Contact Shape | Contact Material | Fastening Type | Insulation Color | Number of Positions | Pitch - Mating | Pitch - Mating | Connector Type | Number of Positions Loaded | Insulation Height | Insulation Height | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Mounting Type | Voltage Rating | Number of Rows | Contact Type | Contact Finish - Post | Style | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.05 in | 1.27 mm | 3.1 A | Square | Phosphor Bronze | Push-Pull | Black | 4 | 0.05 in | 1.27 mm | Receptacle | All | 4.57 mm | 0.18 " | Gold | -55 °C | 125 °C | Solder | Surface Mount | 350 VAC | 2 | Female Socket | Tin | Board to Board Cable | 3 µin | 0.076 µm | |
Samtec Inc. | Liquid Crystal Polymer (LCP) | 0.05 in | 1.27 mm | 3.1 A | Square | Phosphor Bronze | Push-Pull | Black | 4 | 0.05 in | 1.27 mm | Receptacle | All | 4.57 mm | 0.18 " | Gold | -55 °C | 125 °C | Solder | Surface Mount | 350 VAC | 2 | Female Socket | Tin | Board to Board Cable | 3 µin | 0.076 µm | Pick and Place |