SPHWHAHDNF27 Series
Manufacturer: Samsung Semiconductor, Inc.
LED COB D GEN2 WM WHT SQ 3000K
| Part | Size / Dimension Width | Size / Dimension Length | Configuration | Current - Test | Temperature - Test | CCT (K) | CCT Description | Color | Current - Max | Lumens/Watt | CRI (Color Rendering Index) | Light Emitting Surface (LES) Diameter | Voltage - Forward (Vf) (Typ) | Height | Lens Type | Type | Luminous Flux (Typical) | Viewing Angle | Luminous Flux | Luminous Flux (Maximum) | Luminous Flux (Minimum) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 3000 K | 3-Step MacAdam Ellipse | Warm White | 1.38 A | 131 lm/W | 90 | 14.5 mm | 34.6 V | 1.5 mm | Flat | Chip On Board (COB) | 2449 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 5000 K | 3-Step MacAdam Ellipse | Cool White | 1.38 A | 147 lm/W | 90 | 14.5 mm | 34 V | 1.5 mm | Flat | Chip On Board (COB) | 2707 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 4000 K | 3-Step MacAdam Ellipse | Neutral White | 1.08 A | 141 lm/W | 90 | 14.5 mm | 34 V | 1.5 mm | Flat | Chip On Board (COB) | 2581 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 3500 K | 3-Step MacAdam Ellipse | Warm White | 1.38 A | 122 lm/W | 90 | 14.5 mm | 34.6 V | 1.5 mm | Flat | Chip On Board (COB) | 2287 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 2700 K | 3-Step MacAdam Ellipse | Warm White | 1.38 A | 132 lm/W | 90 | 14.5 mm | 34 V | 1.5 mm | Flat | Chip On Board (COB) | 2428 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 600 mA | 85 °C | 4000 K | 3-Step MacAdam Ellipse | Neutral White | 920 mA | 112 lm/W | 90 | 8.5 mm | 35 V | 1.5 mm | Flat | Chip On Board (COB) | 2351 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 3500 K | 2-Step MacAdam Ellipse | Warm White | 970 mA | 123 lm/W | 90 | 17 mm | 34.6 V | 1.5 mm | Domed | Chip On Board (COB) | 115 ° | 2302 lm | 2317 lm | 2287 lm | |
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 3500 K | 3-Step MacAdam Ellipse | Warm White | 1.08 A | 147 lm/W | 90 | 14.5 mm | 33.7 V | 1.5 mm | Flat | Chip On Board (COB) | 2680 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 3000 K | 3-Step MacAdam Ellipse | Warm White | 1.08 A | 131 lm/W | 90 | 14.5 mm | 34 V | 1.5 mm | Flat | Chip On Board (COB) | 2413 lm | 115 ° | |||
Samsung Semiconductor, Inc. | 19 mm | 19 mm | Square | 540 mA | 85 °C | 5000 K | 3-Step MacAdam Ellipse | Cool White | 1.38 A | 90 | 14.5 mm | 34.6 V | 1.5 mm | Flat | Chip On Board (COB) | 115 ° |