LED COB D GEN2 WM WHT SQ 3000K
| Part | Type | Light Emitting Surface (LES) [diameter] | Current - Test | Lens Type | Size / Dimension [y] | Size / Dimension [x] | Height [z] | Color | Temperature - Test | Voltage - Forward (Vf) (Typ) | Configuration | CCT (K) | Current - Max [Max] | Lumens/Watt @ Current - Test | CRI (Color Rendering Index) | Viewing Angle | Luminous Flux @ Current/Temperature | Luminous Flux @ Current/Temperature [Min] | Luminous Flux @ Current/Temperature [Max] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Warm  White  | 85 °C  | 34.6 V  | Square  | 3000 K  | 1.38 A  | 131 lm/W  | 90  | 115 °  | 2449 lm  | ||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Cool  White  | 85 °C  | 34 V  | Square  | 1.38 A  | 147 lm/W  | 90  | 115 °  | 2707 lm  | |||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Neutral  White  | 85 °C  | 34 V  | Square  | 4000 K  | 1.08 A  | 141 lm/W  | 90  | 115 °  | 2581 lm  | ||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Warm  White  | 85 °C  | 34.6 V  | Square  | 3500 K  | 1.38 A  | 122 lm/W  | 90  | 115 °  | 2287 lm  | ||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Warm  White  | 85 °C  | 34 V  | Square  | 2700 K  | 1.38 A  | 132 lm/W  | 90  | 115 °  | 2428 lm  | ||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 8.5 mm  | 600 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Neutral  White  | 85 °C  | 35 V  | Square  | 4000 K  | 920 mA  | 112 lm/W  | 90  | 115 °  | 2351 lm  | ||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 17 mm  | 540 mA  | Domed  | 19 mm  | 19 mm  | 1.5 mm  | Warm  White  | 85 °C  | 34.6 V  | Square  | 3500 K  | 970 mA  | 123 lm/W  | 90  | 115 °  | 2302 lm  | 2287 lm  | 2317 lm  | 
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Warm  White  | 85 °C  | 33.7 V  | Square  | 3500 K  | 1.08 A  | 147 lm/W  | 90  | 115 °  | |||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Warm  White  | 85 °C  | 34 V  | Square  | 3000 K  | 1.08 A  | 131 lm/W  | 90  | 115 °  | 2413 lm  | ||
Samsung Semiconductor, Inc.  | Chip On Board (COB)  | 14.5 mm  | 540 mA  | Flat  | 19 mm  | 19 mm  | 1.5 mm  | Cool  White  | 85 °C  | 34.6 V  | Square  | 1.38 A  | 90  | 115 °  |