44-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Features	Housing Material	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Post	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Mounting Type	Type	Type	Type	Material Flammability Rating
Aries Electronics 44-6573-11	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Tin	0.11 in	2.78 mm	2.54 mm	0.1 in	1 A	Beryllium Copper	5.08 µm	200 µin	44 Positions or Pins	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	UL94 V-0
Aries Electronics 44-6573-16	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Tin	0.11 in	2.78 mm	2.54 mm	0.1 in	1 A	Beryllium Copper	5.08 µm	200 µin	44 Positions or Pins	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	UL94 V-0
Aries Electronics 44-6573-10	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Tin	0.11 in	2.78 mm	2.54 mm	0.1 in	1 A	Beryllium Copper	5.08 µm	200 µin	44 Positions or Pins	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	UL94 V-0