CONN IC DIP SOCKET 14POS TIN
| Part | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Housing Material | Type | Type | Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Termination | Current Rating (Amps) | Features | Contact Finish - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Mounting Type | Contact Material - Post | Contact Finish - Mating | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | 14 | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.3 " | 7.62 mm | DIP | 105 ░C | -55 °C | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | UL94 V-0 | Solder | 1 A | Closed Frame Elevated | Tin | Phosphor Bronze | 3.56 mm | 0.14 in | Through Hole | Phosphor Bronze | ||
Aries Electronics | 2.54 mm | 0.1 in | 14 | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.6 in | 15.24 mm | DIP | 105 ░C | -55 °C | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | UL94 V-0 | Solder | 3 A | Closed Frame Elevated | Gold | Beryllium Copper | 3.56 mm | 0.14 in | Through Hole | Gold | Brass | |
Aries Electronics | 2.54 mm | 0.1 in | 14 | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.3 " | 7.62 mm | DIP | 105 ░C | -55 °C | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | UL94 V-0 | Solder | 3 A | Closed Frame Elevated | Gold | Beryllium Copper | 3.56 mm | 0.14 in | Through Hole | Gold | Brass |