TMS-135 Series
Manufacturer: Samtec Inc.
.050" (1.27MM) MICRO HEADER
| Part | Insulation Color | Insulation Height | Contact Finish - Mating | Number of Positions Loaded | Contact Shape | Current Rating (Per Contact) | Mounting Type | Termination | Connector Type | Overall Contact Length | Row Spacing - Mating | Contact Type | Contact Finish - Post | Contact Finish Thickness - Mating | Number of Positions | Operating Temperature (Max) | Operating Temperature (Min) | Fastening Type | Insulation Material | Pitch - Mating | Contact Length - Mating | Number of Rows | Contact Length - Post | Shrouding | Style | Material Flammability Rating | Contact Material | Contact Finish Thickness - Post | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Black | 0.1 in | Gold | All | Square | 5 A | Through Hole | Solder | Header | 0.505 in | 0.1 in | Male Pin | Gold | 10 µin | 70 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.23 in | 2 | 0.175 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze | 3 µin | |
Samtec Inc. | Black | 0.1 in | Gold | Square | 5 A | Through Hole | Solder | Header | 0.41 in | 0.1 in | Male Pin | Gold | 10 µin | 70 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.19 in | 2 | 0.12 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze | 3 µin | 69 | |
Samtec Inc. | Black | 0.1 in | Gold | All | Square | 5 A | Through Hole | Solder | Header | 0.45 in | 0.1 in | Male Pin | Gold | 10 µin | 70 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.23 in | 2 | 0.12 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze | 3 µin | |
Samtec Inc. | Black | 0.1 in | Gold | All | Square | 5 A | Through Hole | Solder | Header | 0.505 in | Male Pin | Tin | 30 µin | 35 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.23 in | 1 | 0.175 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze | |||
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Samtec Inc. | Black | 0.1 in | Gold | All | Square | 5 A | Through Hole | Solder | Header | 0.65 in | 0.1 in | Male Pin | Tin | 30 µin | 70 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.43 in | 2 | 0.12 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze | ||
Samtec Inc. | Black | 0.1 in | Gold | All | Square | 5 A | Through Hole | Solder | Header | 0.45 in | 0.1 in | Male Pin | Tin | 30 µin | 70 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.23 in | 2 | 0.12 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze | ||
Samtec Inc. | Black | 0.1 in | Gold | All | Square | 5 A | Through Hole | Solder | Header | 0.32 in | 0.1 in | Male Pin | Tin | 10 µin | 70 | 125 °C | -55 °C | Push-Pull | Liquid Crystal Polymer (LCP) | 0.05 in | 0.1 in | 2 | 0.12 in | Unshrouded | Board | UL94 V-0 | Phosphor Bronze |