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CONN IC DIP SOCKET 20POS GOLD
| Part | Contact Material - Post [custom] | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Type | Type | Type | Features | Contact Finish - Mating | Mounting Type | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | Solder | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) | 105 ░C | -55 °C | 2.54 mm | 0.1 in | 20 | UL94 V-0 | Beryllium Copper | 30 Áin | 0.76 Ám | 3.56 mm | 0.14 in | 3 A | 0.1 in | 2.54 mm | 0.3 " | 7.62 mm | DIP | Closed Frame Elevated | Gold | Through Hole | Gold |