24-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS GLD

Part	Termination	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish - Mating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Material - Post	Number of Positions or Pins (Grid)	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Current Rating (Amps)	Mounting Type	Pitch - Post	Pitch - Post
Aries Electronics 24-3570-11	Solder	Gold	0.11 in	2.78 mm	Gold	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Beryllium Copper	24	Closed Frame	10 çin	0.25 çm	UL94 V-0	Beryllium Copper	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	1 A	Through Hole	2.54 mm	0.1 in
Aries Electronics 24-3570-16	Solder	Nickel Boron	0.11 in	2.78 mm	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Beryllium Nickel	24	Closed Frame	50 µin	1.27 µm	UL94 V-0	Beryllium Nickel	50 µin	1.27 µm	Polyphenylene Sulfide (PPS) Glass Filled	1 A	Through Hole	2.54 mm	0.1 in
Aries Electronics 24-3570-10	Solder	Tin	0.11 in	2.78 mm		7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Beryllium Copper	24	Closed Frame	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	1 A	Through Hole	2.54 mm	0.1 in