CONN IC DIP SOCKET 48POS GOLD
| Part | Contact Material - Mating | Pitch - Post | Pitch - Post | Features | Contact Finish - Mating | Material Flammability Rating | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Mounting Type | Type | Type | Type | Contact Finish - Post | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Termination | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6556-41 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | 0.18 in | 4.57 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm | ||
Aries Electronics 48-6556-20 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | 0.283 in | 7.19 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm | Wire Wrap | |
Aries Electronics 48-6556-31 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | 0.423 in | 10.74 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm | Wire Wrap | 150 °C |
Aries Electronics 48-6556-30 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | 0.423 in | 10.74 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm | Wire Wrap | |
Aries Electronics 48-6556-21 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | 0.283 in | 7.19 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm | Wire Wrap | |
Aries Electronics 48-6556-10 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | 0.13 in | 3.3 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm | Solder | |
Aries Electronics 48-6556-40 | Beryllium Copper | 2.54 mm | 0.1 in | Open Frame | Gold | UL94 V-0 | Brass | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | 0.18 in | 4.57 mm | 3 A | Through Hole | DIP | 0.6 in | 15.24 mm | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 48 | 0.1 in | 2.54 mm |