48-6556 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating | Pitch - Mating | Termination | Number of Positions or Pins (Grid) | Grid Columns | Grid Rows | Contact Material - Post | Features | Mounting Type | Row Spacing | Type | Contact Finish - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.283 in | 30 µin | 10 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Wire Wrap | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Gold | Glass Filled Polyphenylene Sulfide PPS | |
Aries Electronics | 3 A | UL94 V-0 | 0.423 in | 30 µin | 200 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Wire Wrap | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin | Glass Filled Polyphenylene Sulfide PPS | |
Aries Electronics | 3 A | UL94 V-0 | 0.18 in | 30 µin | 10 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Solder Cup | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Gold | Glass Filled Polyphenylene Sulfide PPS | |
Aries Electronics | 3 A | UL94 V-0 | 0.283 in | 30 µin | 200 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Wire Wrap | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin | Glass Filled Polyphenylene Sulfide PPS | |
Aries Electronics | 3 A | UL94 V-0 | 0.423 in | 30 µin | 10 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Wire Wrap | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Gold | Glass Filled Polyphenylene Sulfide PPS | 150 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.18 in | 30 µin | 200 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Solder Cup | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin | Glass Filled Polyphenylene Sulfide PPS | |
Aries Electronics | 3 A | UL94 V-0 | 0.13 in | 30 µin | 200 µin | 0.1 in | Beryllium Copper | Gold | 0.1 in | Solder | 48 | 24 | 2 | Brass | Open Frame | Through Hole | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Tin | Glass Filled Polyphenylene Sulfide PPS |