UNIVERSAL TEST SOCKET 48POS
| Part | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Material - Mating | Material Flammability Rating | Housing Material | Termination Post Length | Termination Post Length | Type | Type | Type | Pitch - Mating | Pitch - Mating | Termination | Mounting Type | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Contact Finish - Post | Operating Temperature | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics  | 48  | 30 Áin  | 0.76 Ám  | Open Frame  | Beryllium Copper  | UL94 V-0  | Polyphenylene Sulfide (PPS)  Glass Filled  | 10.74 mm  | 0.423 in  | DIP  | 0.6 in  | 15.24 mm  | 0.1 in  | 2.54 mm  | Wire Wrap  | Through Hole  | 3 A  | Gold  | 200 µin  | 5.08 µm  | Brass  | 2.54 mm  | 0.1 in  | Tin  | |
Aries Electronics  | 48  | 30 Áin  | 0.76 Ám  | Open Frame  | Beryllium Copper  | UL94 V-0  | Polyphenylene Sulfide (PPS)  Glass Filled  | 7.19 mm  | 0.283 in  | DIP  | 0.6 in  | 15.24 mm  | 0.1 in  | 2.54 mm  | Wire Wrap  | Through Hole  | 3 A  | Gold  | 200 µin  | 5.08 µm  | Brass  | 2.54 mm  | 0.1 in  | Tin  | |
Aries Electronics  | 48  | 30 Áin  | 0.76 Ám  | Open Frame  | Beryllium Copper  | UL94 V-0  | Polyphenylene Sulfide (PPS)  Glass Filled  | 10.74 mm  | 0.423 in  | DIP  | 0.6 in  | 15.24 mm  | 0.1 in  | 2.54 mm  | Wire Wrap  | Through Hole  | 3 A  | Gold  | 10 çin  | 0.25 çm  | Brass  | 2.54 mm  | 0.1 in  | Gold  | 150 °C  | 
Aries Electronics  | 48  | 30 Áin  | 0.76 Ám  | Open Frame  | Beryllium Copper  | UL94 V-0  | Polyphenylene Sulfide (PPS)  Glass Filled  | 3.3 mm  | 0.13 in  | DIP  | 0.6 in  | 15.24 mm  | 0.1 in  | 2.54 mm  | Solder  | Through Hole  | 3 A  | Gold  | 200 µin  | 5.08 µm  | Brass  | 2.54 mm  | 0.1 in  | Tin  |