ESS-131 Series

Catalog

CONN SOCKET 31POS 0.1 GOLD PCB

Part	Contact Type	Contact Finish - Post	Number of Positions Loaded	Termination	Insulation Height	Connector Type	Insulation Color	Contact Length - Post	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Style	Number of Positions	Mounting Type	Number of Rows	Contact Finish Thickness - Mating	Fastening Type	Pitch - Mating	Material Flammability Rating	Insulation Material	Contact Material	Contact Shape	Contact Finish Thickness - Post
Samtec Inc. ESS-131-T-05	Female Socket	Tin	All	Solder	0.5 in	Elevated Socket	Black	0.173 in	Gold	125 °C	-55 °C	Board	31	Through Hole	1	10 µin	Push-Pull	0.1 in	UL94 V-0	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESS-131-G-08	Female Socket	Gold	All	Solder	0.3 in	Elevated Socket	Black	0.365 in	Gold	125 °C	-55 °C	Board	31	Through Hole	1	10 µin	Push-Pull	0.1 in	UL94 V-0	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin
Samtec Inc. ESS-131-G-05	Female Socket	Gold	All	Solder	0.5 in	Elevated Socket	Black	0.173 in	Gold	125 °C	-55 °C	Board	31	Through Hole	1	10 µin	Push-Pull	0.1 in	UL94 V-0	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin
Samtec Inc. ESS-131-TT-04	Female Socket	Tin	All	Solder	0.4 in	Elevated Socket	Black	0.123 in	Tin	125 °C	-55 °C	Board	31	Through Hole	1		Push-Pull	0.1 in	UL94 V-0	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESS-131-T-04	Female Socket	Tin	All	Solder	0.4 in	Elevated Socket	Black	0.123 in	Gold	125 °C	-55 °C	Board	31	Through Hole	1	10 µin	Push-Pull	0.1 in	UL94 V-0	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESS-131-G-06	Female Socket	Gold	All	Solder	0.3 in	Elevated Socket	Black	0.215 in	Gold	125 °C	-55 °C	Board	31	Through Hole	1	10 µin	Push-Pull	0.1 in	UL94 V-0	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin