ESD-116 Series

Catalog

CONN SOCKET 32POS 0.1 TIN PCB

Part	Contact Type	Connector Type	Fastening Type	Pitch - Mating	Number of Positions Loaded	Insulation Height	Insulation Color	Row Spacing - Mating	Material Flammability Rating	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions	Number of Rows	Mounting Type	Style	Contact Length - Post	Termination	Contact Finish - Post	Insulation Material	Contact Material	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. ESD-116-TT-06	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.3 in	Black	0.1 in	UL94 V-0	Tin	125 °C	-55 °C	32	2	Through Hole	Board	0.215 in	Solder	Tin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESD-116-T-04	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.4 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.253 in	Solder	Tin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin
Samtec Inc. ESD-116-G-07	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.4 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.265 in	Solder	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin
Samtec Inc. ESD-116-G-08	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.3 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.365 in	Solder	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin
Samtec Inc. ESD-116-T-24	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.4 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.115 in	Solder	Tin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin
Samtec Inc. ESD-116-TT-04	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.4 in	Black	0.1 in	UL94 V-0	Tin	125 °C	-55 °C	32	2	Through Hole	Board	0.253 in	Solder	Tin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESD-116-TT-23	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.3 in	Black	0.1 in	UL94 V-0	Tin	125 °C	-55 °C	32	2	Through Hole	Board	0.115 in	Solder	Tin	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular
Samtec Inc. ESD-116-G-06	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.3 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.215 in	Solder	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin
Samtec Inc. ESD-116-G-23	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.3 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.115 in	Solder	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin
Samtec Inc. ESD-116-G-03	Female Socket	Elevated Socket	Push-Pull	0.1 in	All	0.3 in	Black	0.1 in	UL94 V-0	Gold	125 °C	-55 °C	32	2	Through Hole	Board	0.153 in	Solder	Gold	Liquid Crystal Polymer (LCP)	Beryllium Copper	Circular	10 µin	10 µin