24-650 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination	Type	Type	Type	Mounting Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Features	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Housing Material	Contact Finish - Mating	Termination Post Length [x]	Termination Post Length [x]	Operating Temperature [Max]	Operating Temperature [Min]	Termination Post Length	Termination Post Length	Contact Material - Post
Aries Electronics 24-6508-20	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	200 µin	5.08 µm	Tin	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.36 in	9.14 mm	105 ░C	-55 °C
Aries Electronics 24-6508-212	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	10 çin	0.25 çm	Gold	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold			125 °C	-55 °C	0.5 in	12.7 mm
Aries Electronics 24-6508-301	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	200 µin	5.08 µm	Tin	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.36 in	9.14 mm	105 ░C	-55 °C
Aries Electronics 24-6508-311	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	10 çin	0.25 çm	Gold	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold			125 °C	-55 °C	0.5 in	12.7 mm
Aries Electronics 24-6503-21	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Closed Frame	24	10 çin	0.25 çm	Gold	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm		Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.36 in	9.14 mm	125 °C	-55 °C			Phosphor Bronze
Aries Electronics 24-6503-20	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Closed Frame	24	200 µin	5.08 µm	Tin	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm		Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.36 in	9.14 mm	105 ░C	-55 °C			Phosphor Bronze
Aries Electronics 24-6508-302	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	200 µin	5.08 µm	Tin	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.36 in	9.14 mm	105 ░C	-55 °C
Aries Electronics 24-6508-211	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	10 çin	0.25 çm	Gold	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold			125 °C	-55 °C	0.5 in	12.7 mm
Aries Electronics 24-6501-21	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	1.5 A	0.1 in	2.54 mm	UL94 V-0	Closed Frame	24	10 çin	0.25 çm	Gold	Phosphor Bronze	2.54 mm	0.1 in	10 çin	0.25 çm		Glass Filled Nylon 4/6 Polyamide (PA46)	Gold			125 °C	-55 °C	0.41 in	10.41 mm	Phosphor Bronze
Aries Electronics 24-6508-30	Wire Wrap	DIP	0.6 in	15.24 mm	Through Hole	3 A	0.1 in	2.54 mm	UL94 V-0	Open Frame	24	200 µin	5.08 µm	Tin	Beryllium Copper	2.54 mm	0.1 in	30 Áin	0.76 Ám	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	0.36 in	9.14 mm	105 ░C	-55 °C