CONN HEADER SMD 22POS 1.27MM
| Part | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Number of Positions Loaded | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish - Post | Contact Length - Mating | Contact Length - Mating | Connector Type | Mounting Type | Number of Positions | Insulation Material | Insulation Height | Insulation Height | Style | Contact Type | Fastening Type | Row Spacing - Mating | Row Spacing - Mating | Termination | Number of Rows | Shrouding | Pitch - Mating | Pitch - Mating | Contact Material | Contact Length - Post [x] | Contact Length - Post | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | -55 °C | 125 °C | Square | All | Black | 10 çin | 0.25 çm | Keying Slot Pick and Place | Tin | 3.05 mm | 0.12 in | Header | Surface Mount | 22 positions | Liquid Crystal Polymer (LCP) | 5.45 mm | 0.215 in | Board to Cable/Wire | Male Pin | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Shrouded - 4 Wall | 0.05 in | 1.27 mm | Phosphor Bronze | |||
Samtec Inc. | Gold | -55 °C | 125 °C | Square | All | Black | 10 çin | 0.25 çm | Board Lock Keying Slot Pick and Place | Tin | 3.05 mm | 0.12 in | Header | Surface Mount | 22 positions | Liquid Crystal Polymer (LCP) | 5.45 mm | 0.215 in | Board to Cable/Wire | Male Pin | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Shrouded - 4 Wall | 0.05 in | 1.27 mm | Phosphor Bronze | |||
Samtec Inc. | Gold | -55 °C | 125 °C | Square | All | Black | 10 çin | 0.25 çm | Keying Slot | Tin | 3.05 mm | 0.12 in | Header | Through Hole | 22 positions | Liquid Crystal Polymer (LCP) | 5.33 mm | Board to Cable/Wire | Male Pin | Push-Pull | 0.05 in | 1.27 mm | Solder | 2 | Shrouded - 4 Wall | 0.05 in | 1.27 mm | Phosphor Bronze | 0.075 in | 1.91 mm | 0.21 in |