
MCP23S08 Series
Manufacturer: Microchip Technology
I/O EXPANDER, 8BIT, 10 MHZ, SERIAL, SPI, 1.8 V, 5.5 V, SSOP ROHS COMPLIANT: YES
| Part | Clock Frequency | Package Name | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Mounting Type | Interrupt Output | Features | Output Type | Interface | Current - Output Source/Sink | Number of I/O | Operating Temperature (Max) | Operating Temperature (Min) | Package Width | Package Length | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 10 MHz | 20-SSOP | 5.5 V | 1.8 V | Surface Mount | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 5.3 mm | 0.209 in | |
Microchip Technology | 10 MHz | 20-QFN | 5.5 V | 1.8 V | Surface Mount | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 4 mm | 4 mm | 20-VFQFN Exposed Pad |
Microchip Technology | 10 MHz | 18-SOIC | 5.5 V | 1.8 V | Surface Mount | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 7.5 mm | 0.295 in | |
Microchip Technology | 10 MHz | 20-SSOP | 5.5 V | 1.8 V | Surface Mount | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 5.3 mm | 0.209 in | |
Microchip Technology | 10 MHz | 20-QFN | 5.5 V | 1.8 V | Surface Mount | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 4 mm | 4 mm | 20-VFQFN Exposed Pad |
Microchip Technology | 10 MHz | 18-SOIC | 5.5 V | 1.8 V | Surface Mount | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 7.5 mm | 0.295 in | |
Microchip Technology | 10 MHz | 18-DIP 18-PDIP | 5.5 V | 1.8 V | Through Hole | Yes | POR | Push-Pull | SPI | 25 mA | 8 | 125 °C | -40 °C | 7.62 mm | 0.3 in |